Achieve perfect soldering results with this 50g Low Temperature Lead-Free Solder Paste! With a melting point of just 138°C, this no-clean formula is ideal for delicate PCB work, mobile phone repairs, and sensitive component soldering, reducing thermal stress and minimizing the risk of board damage.
 
Key Features:
🔥 Low Melting Point 138°C: Perfect for reworking and soldering delicate electronic components without overheating.
🌱 Lead-Free & No Clean: Environmentally friendly with minimal residue – no cleaning required after soldering.
🛠️ Precise Application: Supplied in a 50g syringe with dispensing needles for easy, controlled application.
📏 Fine Particle Size: 20–38μm particle size ensures smooth and consistent paste flow for professional results.
📱 Ideal for Micro Soldering: Great for phone motherboards, SMD components, PCBs, and other sensitive electronic assemblies.
 
Specifications:
Alloy Composition: Sn42/Bi58 (Tin 42%, Bismuth 58%)
Melting Point: 138°C
Particle Size: 20–38μm
Weight: 50g
Type: Lead-Free, No-Clean Formula
Application: SMD, mobile phone, PCB, laptop board repairs
 
Package Includes:
1x 50g Syringe of 138°C Low Temperature Lead-Free Solder Paste
2x Dispensing Needles (different sizes for precision use)
 
Ideal For:
Mobile phone component repair
Laptop and console motherboard soldering
Delicate PCB rework and assembly
Low-temp SMD soldering projects